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Laser drilling delivers micro-holes with diameters from <10 µm to several millimetres with excellent roundness and edge quality — all without mechanical contact, tool wear, or cracking. UV and green laser platforms enable cold ablation on sensitive materials where conventional drilling causes thermal damage.
From photovoltaic glass drilling and PCB via formation to brass micro-holes and ceramic through-holes, Monotek supplies and integrates the right laser platform for your drilling geometry, depth, taper, and throughput requirement.
Compatible Materials
One or more overlapping pulses drill a hole at one point, ideal for thin materials and fine hole diameters.
The beam orbits the hole axis to generate larger, cleaner holes with improved edge quality and reduced taper.
Ultra-fast pulse bursts improve drilling in glass, ceramics, and brittle materials while minimizing micro-cracking.
High-speed galvo scanning drills thousands of holes per second for PCB, film, and solar cell applications.
Achieve extremely fine hole diameters with excellent roundness and repeatability across high-density drilling patterns.
Micro PrecisionUV and green laser systems reduce thermal impact and help prevent cracking, chipping, and burn marks on fragile materials.
Cold AblationSupport for straight, angled, trepanned, and shaped-hole drilling on metals, glass, ceramics, and electronic substrates.
Flexible ProcessGalvo-based drilling systems deliver high-throughput processing for PCB vias, film perforation, and solar applications.
Mass ProductionMicro-hole drilling and glass processing for solar modules and precision energy devices.
PCB via drilling, ceramic substrate holes, flex-film perforation, and semiconductor processing.
Cold-ablation drilling for cover glass, display glass, optical glass, and brittle transparent materials.
Micro-hole drilling on metals and alloys for nozzles, filters, sensors, and special components.
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